Pyrophosphate Copper Plating Process
Characteristics
1. Provide a stable bright ductile copper deposit.
2. Excellent leveling power & throwing power for PC board, Zinc alloy, ABS plating.
3. Single additive, easy control & operation.
4. Not easy to burn on high current density area.
Operating data
Range | Optimum | |
Copper pyrophosphate | 75-95 gm/l |
85 gm/l |
Potassium pyrophosphate | 280-350 gm/l | 310 gm/l |
Ammonium (28%) | 3-4 cc/l | 3 cc/l |
Forbrite YP-20X | 0.1-0.2 cc/l | 0.15 cc/l |
Forbrite YP-30X | 0.067-0.13 cc/l | 0.10 cc/l |
pH value | 8.0-8.9 |
8.7 |
P rate (Pyrophosphate/copper) | 6.4-7.5 | 7.0 |
Temperature | 50-60℃ | 57℃ |
Cathode current density | 1-8 A/dm2 | 4 A/dm2 |
Andoes | Electrolytic copper anodes or OFHC copper (Ca. 0.02-0.08%P), anode current density 1.5-3 A/dm2 | |
Agitation | Vigorous air agitation |
Replenishment
12.5- 15 ml Forbrite YP-20X solution replenished per 1000 ampere hours.
Packing
30kgs/ Plastic drum