Pyrophosphate Copper Plating Process

 

 

         Characteristics

                    1. Provide a stable bright ductile copper deposit.

                    2. Excellent leveling power & throwing power for PC board, Zinc alloy, ABS plating.

                    3. Single additive, easy control & operation.

                    4. Not easy to burn on high current density area.

        Operating data

                         Range              Optimum
   Copper pyrophosphate           75-95 gm/l

      85 gm/l

 Potassium pyrophosphate       280-350 gm/l             310 gm/l
       Ammonium (28%)                3-4 cc/l                 3 cc/l
        Forbrite YP-20X         0.1-0.2 cc/l            0.15 cc/l
        Forbrite YP-30X      0.067-0.13 cc/l            0.10 cc/l
               pH  value              8.0-8.9

8.7

 P rate (Pyrophosphate/copper)           6.4-7.5                7.0
           Temperature           50-60               57
      Cathode current density          1-8 A/dm2            4 A/dm2
               Andoes  Electrolytic copper anodes or OFHC copper (Ca. 0.02-0.08%P), anode current density 1.5-3 A/dm2
              Agitation    Vigorous air agitation

       Replenishment

                              12.5- 15 ml Forbrite YP-20X solution replenished per 1000 ampere hours.

       Packing

                              30kgs/ Plastic drum